Leading the future of power electronics
We provide wafer-level opto-electronic packaging and SiC interposer solutions for co-packaged optics (CPO) and advanced 2.5D/3D integration—like a dedicated CoWoS-style foundry for silicon photonics and high-performance compute.
1.8×
More Chips Per Wafer (6" → 8")
$700
Target Price (2025) Per 8" Wafer
Key Insight
Interposer applications do not require the ultra-low defect densities of power devices. This allows a wider pool of wafers to qualify, significantly reducing effective cost.
8" SiC wafer interposers with TSV and RDL: ~3× better thermal conductivity than silicon (490 vs 150 W/mK), lower electrical loss, and robust mechanical support for 1.6T/3.2T co-packaged optics.
EIC-on-PIC integration with BGBM, TSV, and RDL. Sub-50μm interconnects for 200G/lane signal integrity. Wafer-level opto-electronic packaging for CPO and advanced modules.
SiC TSV interposer solutions for 1.6T CPO: high thermal conductivity and high-density vertical interconnect. Lower thermal resistance and reduced electrical loss for next-gen switch ASIC and optical engine co-package.
2.5D/3D SiC TSV interposer and local interconnect (LSI) capability. High-density RDL and micro-bump compatible—the advanced packaging layer that brings logic, memory, and optics together.
CPO and silicon photonics leaders, design houses, and HPC/AI chip and optical module makers who need high-thermal, high-density SiC interposer and wafer-level packaging—without 12" SiC dependency. We focus on 8" SiC today: production-ready and cost-effective.
We are pioneers in Silicon Carbide (SiC) module technology, delivering innovative power solutions that enable the next generation of electric vehicles, renewable energy systems, and industrial applications.
With over 15 years of experience in power electronics, we have established ourselves as a trusted partner for companies worldwide seeking reliable, high-performance SiC solutions.
Our advanced manufacturing processes and rigorous quality control ensure that every module meets the highest standards of performance and reliability.
25%
of revenue
99.9%
product reliability
Silicon Carbide Power Modules
Discover our comprehensive range of SiC power modules designed for various applications
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Explore our comprehensive SiC module product portfolio and technical specifications
info@pnsemi.com
+1 2066585759
9407 NE VANCOUVER MALL DR STE 104,
VANCOUVER, WA, 98662-6191,UNITED STATES
Monday - Friday: 9:00 AM - 6:00 PM
Saturday: 10:00 AM - 4:00 PM
We're here to help with all your SiC module needs. Reach out using the contact information on the left.
Our technical team is available to assist you with product specifications, application guidance, and custom solutions. We typically respond to inquiries within 24 hours during business days.